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Comparison of properties of silicon-containing poly(amide-imide)s

  • New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations

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Author:Ion Sava, Maria Bruma, Burkhard SchulzORCiDGND, Thomas Köpnick
Document Type:Article
Year of first Publication:2005
Year of Completion:2005
Release Date:2017/03/24
Source:High Performance Polymers. - ISSN 0954-0083. - 17 (2005), 4, S. 483 - 495
Organizational units:Mathematisch-Naturwissenschaftliche Fakultät / Institut für Physik und Astronomie
Peer Review:Referiert
Institution name at the time of publication:Mathematisch-Naturwissenschaftliche Fakultät / Institut für Physik