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We investigated the possibility of minimizing tensile matrix residual stresses in age hardenable aluminum alloy metal matrix composites without detrimentally affect their mechanical properties (such as yield strength). Specifically, we performed thermal treatments at different temperatures and times in an age-hardenable aluminum matrix composite 2014Al-15vol%Al2O3. Using X-ray synchrotron radiation diffraction and mechanical tests, we show that below a certain treatment temperature (250 degrees C) it is possible to identify an appropriate thermal treatment capable of relaxing residual stress in this composite while even increasing its yield strength, with respect to the as processed conditions.
In order to provide further evidence of damage mechanisms predicted by the recent solid-state transformation creep (SSTC) model, direct observation of damage accumulation during creep of Al-3.85Mg was made using synchrotron X-ray refraction. X-ray refraction techniques detect the internal specific surface (i.e. surface per unit volume) on a length scale comparable to the specimen size, but with microscopic sensitivity. A significant rise in the internal specific surface with increasing creep time was observed, providing evidence for the creation of a fine grain substructure, as predicted by the SSTC model. This substructure was also observed by scanning electron microscopy.
The present work offers an explanation for the variation of the power-law stress exponent, n, with the stress sigma normalized to the shear modulus G in aluminum alloys. The approach is based on the assumption that the dislocation structure generated with deformation has a fractal nature. It fully explains the evolution of n with sigma/G even beyond the so-called power law breakdown region. Creep data from commercially pure Al99.8%, Al-3.85%Mg, and ingot AA6061 alloy tested at different temperatures and stresses are used to validate the proposed ideas. Finally, it is also shown that the fractal description of the dislocation structure agrees well with current knowledge. Published by AIP Publishing.