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Synthesis of fluorinated poly(phenylquinoxaline-amide)s and study of thin films made therefrom
(1999)
A series of five fluorinated poly(phenylquinoxaline-amide)s were synthesized by a polycondensation reaction of a diacid chloride containing the hexafluoroisopropylidene (6F) group, namely 2,2-bis(p-chlorocarbonylphenyl)- hexafluoropropane, with various aromatic diamines incorporating two phenyl-substituted quinoxaline rings. These polymers were easily soluble in polar aprotic solvents such as N-methylpyrrolione (NMP), dimethylformamide (DMF), and tetrahydrofurane (THF), and showed a high thermal stability with decomposition temperatures above 400 °C and glass transition temperatures in the range of 260-290 Tg. Polymer solutions in NMP were processed into free-standing films that showed low dielectric constant values, in the range of 3.4-3.9, and good mechanical properties, with tensile strength in the range of 40-80 MPa and elongation to break in the range of 22-55%. Very thin films, in the range of tens of nanometer, which were deposited onto silicon wafers exhibited very smooth surfaces, free of pinholes when studied by atomic force microscopy (AFM).
A series of new arornatic poly(hydrazide-ester)s has been synthesized by solution polycondensation of two diacid dichlorides containing preformed ester groups with phenoxyterephthaloyl dihydrazide or with a mixture of phenoxyterephthaloyl dihydrazide with terephthaloyl- or isophthaloyl dihydrazide in N-methyl-2-pyrrolidinone. The thermal cyclization of the poly(hydrazide-ester)s gave the corresponding poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups. The polymers were characterized by viscometry, solubility measurements, IR spectroscopy, differential scanning calorimetry and thermogravimetric analysis.
New heterocyclic polyamides have been synthesized by solution polycondensation of aromatic diamines containing phenyl- quinoxaline units with diacid chlorides having both imide and hexafluoroisopropylidene (6F) groups. These polymers are soluble in polar aprotic solvents, such as N-methylpyrrolidone (NMP) or N,N-dimethylformamide (DMF), and can be cast into flexible thin films from solutions. They show high thermooxidative stability with decomposition temperatures above 400°C and glass transition temperatures in the range of 225 - 300°C. The polymer films exhibit good chemical resistance towards deluted acids and good electrical insulating properties with dielectric constants in the range of 3.2 - 3.7.