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We present a method employing Answer Set Programming in combination with Approximate Model Counting for fast and accurate calculation of error propagation probabilities in digital circuits. By an efficient problem encoding, we achieve an input data format similar to a Verilog netlist so that extensive preprocessing is avoided. By a tight interconnection of our application with the underlying solver, we avoid iterating over fault sites and reduce calls to the solver. Several circuits were analyzed with varying numbers of considered cycles and different degrees of approximation. Our experiments show, that the runtime can be reduced by approximation by a factor of 91, whereas the error compared to the exact result is below 1%.
Use of a standard non-rad-hard digital cell library in the rad-hard design can be a cost-effective solution for space applications. In this paper we demonstrate how a standard non-rad-hard flip-flop, as one of the most vulnerable digital cells, can be converted into a rad-hard flip-flop without modifying its internal structure. We present five variants of a Triple Modular Redundancy (TMR) flip-flop: baseline TMR flip-flop, latch-based TMR flip-flop, True-Single Phase Clock (TSPC) TMR flip-flop, scannable TMR flip-flop and self-correcting TMR flipflop. For all variants, the multi-bit upsets have been addressed by applying special placement constraints, while the Single Event Transient (SET) mitigation was achieved through the usage of customized SET filters and selection of optimal inverter sizes for the clock and reset trees. The proposed flip-flop variants feature differing performance, thus enabling to choose the optimal solution for every sensitive node in the circuit, according to the predefined design constraints. Several flip-flop designs have been validated on IHP's 130nm BiCMOS process, by irradiation of custom-designed shift registers. It has been shown that the proposed TMR flip-flops are robust to soft errors with a threshold Linear Energy Transfer (LET) from (32.4 MeV.cm(2)/mg) to (62.5 MeV.cm(2)/mg), depending on the variant.
This study investigates the use of pulse stretching (skew-sized) inverters for monitoring the variation of count rate and linear energy transfer (LET) of energetic particles. The basic particle detector is a cascade of two pulse stretching inverters, and the required sensing area is obtained by connecting up to 12 two-inverter cells in parallel and employing the required number of parallel arrays. The incident particles are detected as single-event transients (SETs), whereby the SET count rate denotes the particle count rate, while the SET pulsewidth distribution depicts the LET variations. The advantage of the proposed solution is the possibility to sense the LET variations using fully digital processing logic. SPICE simulations conducted on IHP's 130-nm CMOS technology have shown that the SET pulsewidth varies by approximately 550 ps over the LET range from 1 to 100 MeV center dot cm(2) center dot mg(-1). The proposed detector is intended for triggering the fault-tolerant mechanisms within a self-adaptive multiprocessing system employed in space. It can be implemented as a standalone detector or integrated in the same chip with the target system.
This paper investigates the applicability of CMOS decoupling cells for mitigating the Single Event Transient (SET) effects in standard combinational gates. The concept is based on the insertion of two decoupling cells between the gate's output and the power/ground terminals. To verify the proposed hardening approach, extensive SPICE simulations have been performed with standard combinational cells designed in IHP's 130 nm bulk CMOS technology. Obtained simulation results have shown that the insertion of decoupling cells results in the increase of the gate's critical charge, thus reducing the gate's soft error rate (SER). Moreover, the decoupling cells facilitate the suppression of SET pulses propagating through the gate. It has been shown that the decoupling cells may be a competitive alternative to gate upsizing and gate duplication for hardening the gates with lower critical charge and multiple (3 or 4) inputs, as well as for filtering the short SET pulses induced by low-LET particles.
The relentless improvement of silicon photonics is making optical interconnects and networks appealing for use in miniaturized systems, where electrical interconnects cannot keep up with the growing levels of core integration due to bandwidth density and power efficiency limitations. At the same time, solutions such as 3D stacking or 2.5D integration open the door to a fully dedicated process optimization for the photonic die. However, an architecture-level integration challenge arises between the electronic network and the optical one in such tightly-integrated parallel systems. It consists of adapting signaling rates, matching the different levels of communication parallelism, handling cross-domain flow control, addressing re-synchronization concerns, and avoiding protocol-dependent deadlock. The associated energy and performance overhead may offset the inherent benefits of the emerging technology itself. This paper explores a hybrid CMOS-ECL bridge architecture between 3D-stacked technology-heterogeneous networks-on-chip (NoCs). The different ways of overcoming the serialization challenge (i.e., through an improvement of the signaling rate and/or through space-/wavelength division multiplexing options) give rise to a configuration space that the paper explores, in search for the most energy-efficient configuration for high-performance.
A hybrid design approach of the hierarchical physical implementation design flow is presented and demonstrated on a fault-tolerant low-power multiprocessor system. The proposed flow allows to implement selected submodules in parallel with contrary requirements such as identical placement and individual block implementation. The overall system contains four Leon2 cores and communicates via the Waterbear framework and supports Adaptive Voltage Scaling (AVS) functionality. Three of the processor core variants are derived from the first baseline reference core but implemented individually at block level based on their clock tree specification. The chip is prepared for space applications and designed with triple modular redundancy (TMR) for control parts. The low-power performance is enabled by contemporary power and clock management control. An ASIC is fabricated in a low-power 0.13 mu m BiCMOS technology process node.