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Aromatic polyamides containing silicon and phenylquinoxaline rings in the main chain have been prepared by polycondensation reaction of a silicon-containing diacid chloride, namely bis(p-chlorocarbonylphenyl) -diphenylsilane, with various aromatic diamines having preformed phenylquinoxaline units. These polymers were easily soluble in polar aprotic solvents, such as N-methylpyrrolidinone (NMP) and dimethylformamide (DMF), and in tetrahydrofurane. They showed high thermal stability with decomposition temperature being above 450°C and glass transition temperature in the range of 253-304°C. Polymer solutions in NMP were processed into thin films having the thickness of tens of nanometer to 10 mm, by spin-coating onto glass plates or silicon wafers. The films had strong adhesion to substrates and exhibited very smooth surfaces, free of pinholes, in atomic force microscopy (AFM) studies. The free-standing films had dielectric constant in the range of 3.48-3.69. Thermal treatment of the films up to 350°C rendered them completely insoluble in organic solvents, while maintaining their smoothness and strong adhesion to the silicon substrate, and with no Tg in DSC experiments. Their FTIR spectra did not show any changes compared to the untreated films, meaning that polymers maintain their structural integrity at high temperature. Ó 1999 Elsevier Science S.A. All rights reserved.
A series of copolymers containing oxadiazole and fluorene cromophores was synthesized by polycondensation of a diacid chloride incorporating one diphenylsilane linkage and a mixture of aromatic diamines containing oxadiazole and fluorene moieties. The solubility, thermal behavior, and photoluminescence ability of the thin polymer films were studied and compared with related heterocyclic polymers. These polymers are semicrystalline and form plastic mesophases in the first heating run, which brings about new ordered melted state processing opportunities. They exhibited blue photoluminescence in nanometric films, thus being promising candidates for manufacturing electroluminescent devices.
A series of new poly-1,3,4-oxadiazoles has been synthesized by polycondensation reaction of hydrazine sulfate with a mixture of a dicarboxylic acid containing unsaturated bonds and a dicarboxylic acid containing silicon, by using methanesulfonic acid/phosphorus pentoxide as a reaction medium. These polymers were highly thermostable but they were only soluble in strong inorganic acids such as sulfuric or methanesulfonic ones. An alternative way was followed by using the corresponding dihydrazides containing unsaturated bonds and the corresponding diacid chloride containing silicon that reacted in N-methylpyrrolidinone (NMP) to give soluble silicon-containing unsaturated polyhydrazides, which were cyclodehydrated either by thermal or chemical treatment to give the corresponding polyoxadiazoles. Very thin coatings of polyhydrazides and polyoxadiazoles were deposited onto silicon wafers and they showed a very smooth surface, free of pinholes, when studied by atomic force microscopy (AFM). Some polyoxadiazole films showed strong blue photoluminescence.
A series of new arornatic poly(hydrazide-ester)s has been synthesized by solution polycondensation of two diacid dichlorides containing preformed ester groups with phenoxyterephthaloyl dihydrazide or with a mixture of phenoxyterephthaloyl dihydrazide with terephthaloyl- or isophthaloyl dihydrazide in N-methyl-2-pyrrolidinone. The thermal cyclization of the poly(hydrazide-ester)s gave the corresponding poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups. The polymers were characterized by viscometry, solubility measurements, IR spectroscopy, differential scanning calorimetry and thermogravimetric analysis.
New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations