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Programmable microscale stiffness pattern of flat polymeric substrates by temperature-memo technology

  • Temperature-memory technology was utilized to generate flat substrates with a programmable stiffness pattern from cross-linked poly(ethylene-co-vinyl acetate) substrates with cylindrical microstructures. Programmed substrates were obtained by vertical compression at temperatures in the range from 60 to 100 degrees C and subsequent cooling, whereby a flat substrate was achieved by compression at 72 degrees C, as documented by scanning electron microscopy and atomic force microscopy (AFM). AFM nanoindentation experiments revealed that all programmed substrates exhibited the targeted stiffness pattern. The presented technology for generating polymeric substrates with programmable stiffness pattern should be attractive for applications such as touchpads. optical storage, or cell instructive substrates.

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Author details:Yi JiangGND, Ulrich MansfeldGND, Karl KratzORCiD, Andreas LendleinORCiDGND
DOI:https://doi.org/10.1557/mrc.2019.24
ISSN:2159-6859
ISSN:2159-6867
Title of parent work (English):MRS Communications
Publisher:Cambridge Univ. Press
Place of publishing:New York
Publication type:Article
Language:English
Date of first publication:2019/03/15
Publication year:2019
Release date:2021/03/23
Volume:9
Issue:1
Number of pages:8
First page:181
Last Page:188
Funding institution:Helmholtz-AssociationHelmholtz Association; German Federal Ministry for Education and ResearchFederal Ministry of Education & Research (BMBF) [031A095]
Organizational units:Mathematisch-Naturwissenschaftliche Fakultät / Institut für Chemie
DDC classification:5 Naturwissenschaften und Mathematik / 54 Chemie / 540 Chemie und zugeordnete Wissenschaften
Peer review:Referiert
License (German):License LogoCC-BY - Namensnennung 4.0 International
External remark:Zweitveröffentlichung in der Schriftenreihe Postprints der Universität Potsdam :[Mathematisch-Naturwissenschaftliche Reihe]; [1102]
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