Comparison of properties of silicon-containing poly(amide-imide)s
- New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations
| Author details: | Ion Sava, Maria Bruma, Burkhard SchulzORCiDGND, Thomas Köpnick |
|---|---|
| ISSN: | 0954-0083 |
| Publication type: | Article |
| Language: | English |
| Year of first publication: | 2005 |
| Publication year: | 2005 |
| Release date: | 2017/03/24 |
| Source: | High Performance Polymers. - ISSN 0954-0083. - 17 (2005), 4, S. 483 - 495 |
| Organizational units: | Mathematisch-Naturwissenschaftliche Fakultät / Institut für Physik und Astronomie |
| Peer review: | Referiert |
| Institution name at the time of the publication: | Mathematisch-Naturwissenschaftliche Fakultät / Institut für Physik |
