TY  - JOUR
A1  - Sava, Ion
A1  - Bruma, Maria
A1  - Schulz, Burkhard
A1  - Köpnick, Thomas
T1  - Comparison of properties of silicon-containing poly(amide-imide)s
N2  - New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations
Y1  - 2005
SN  - 0954-0083
ER  -