TY - JOUR A1 - Angelova, Angelina A1 - Penacorada, Florencio A1 - Stiller, Burkhard A1 - Zetzsche, Thomas A1 - Ionov, Radoslav A1 - Kamusewitz, Helmut A1 - Brehmer, Ludwig T1 - Wettability, surface morphology and stability of long chain ester multilayers obtained by different Langmuir- Blodgett deposition type Y1 - 1994 ER - TY - JOUR A1 - Asawapirom, Udom A1 - Bulut, F. A1 - Farrell, Tony A1 - Gadermaier, C. A1 - Gamerith, S. A1 - Güntner, Roland A1 - Kietzke, Thomas A1 - Patil, S. A1 - Piok, T. A1 - Montenegro, Rivelino V. D. A1 - Stiller, Burkhard A1 - Tiersch, Brigitte A1 - Landfester, Katharina A1 - List, E. J. W. A1 - Neher, Dieter A1 - Torres, C. S. A1 - Scherf, Ullrich T1 - Materials for polymer electronics applications semiconducting polymer thin films and nanoparticles N2 - The paper presents two different approaches to nanostructured semiconducting polymer materials: (i) the generation of aqueous semiconducting polymer dispersions (semiconducting polymer nanospheres SPNs) and their processing into dense films and layers, and (ii) the synthesis of novel semiconducting polyfluorene-block-polyaniline (PF-b-PANI) block copolymers composed of conjugated blocks of different redox potentials which form nanosized morphologies in the solid state Y1 - 2004 SN - 1022-1360 ER - TY - JOUR A1 - Bruma, Maria A1 - Hamciuc, Elena A1 - Schulz, Burkhard A1 - Köpnick, Thomas A1 - Stiller, Burkhard A1 - Mercer, Frank W. T1 - Synthesis of fluorinated poly(phenylquinoxaline-amide)s and study of thin films made therefrom N2 - A series of five fluorinated poly(phenylquinoxaline-amide)s were synthesized by a polycondensation reaction of a diacid chloride containing the hexafluoroisopropylidene (6F) group, namely 2,2-bis(p-chlorocarbonylphenyl)- hexafluoropropane, with various aromatic diamines incorporating two phenyl-substituted quinoxaline rings. These polymers were easily soluble in polar aprotic solvents such as N-methylpyrrolione (NMP), dimethylformamide (DMF), and tetrahydrofurane (THF), and showed a high thermal stability with decomposition temperatures above 400 °C and glass transition temperatures in the range of 260-290 Tg. Polymer solutions in NMP were processed into free-standing films that showed low dielectric constant values, in the range of 3.4-3.9, and good mechanical properties, with tensile strength in the range of 40-80 MPa and elongation to break in the range of 22-55%. Very thin films, in the range of tens of nanometer, which were deposited onto silicon wafers exhibited very smooth surfaces, free of pinholes when studied by atomic force microscopy (AFM). Y1 - 1999 ER - TY - JOUR A1 - Bruma, Maria A1 - Sava, Ion A1 - Mercer, Frank W. A1 - Reddy, Victor N. A1 - Köpnick, Thomas A1 - Stiller, Burkhard A1 - Schulz, Burkhard T1 - Silicon-containing poly(amide-ether)s N2 - New aromatic poly(amide-ether)s (II) have been synthesized by solution polycondensation of various aromatic diamines having two ether bridges (I) with a diacid chloride containing silicon, namely bis(chlorocarbonylphenyl)- diphenyIsilane. These polymers are easy soluble in polar amidic solvents such as N-methylpyrrolidinone or dimethylformamide and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability with initial decomposition temperature being above 400 °C. Their glass transition temperatures lie in the range of 220-250 °C, except for polymer He which did not show a clear Tg when heated in a differential scanning calorimetry experiment up to 300 °C. The large interval between the glass transition and decomposition temperatures of pnlymers Ia-Id could be advantageous for their processing via compression molding. The polymer coatings deposited by the spincoating, technique onto silicon wafers showed a very smooth, pinhole-free surface in atomic force microscopy investigations. The free-standing films of 20-30 mm thickness show low dielectric constant, in the range of 3.65-3.78, which is promising for future application as high performance dielectrics. Y1 - 1998 ER - TY - JOUR A1 - Bruma, Maria A1 - Schulz, Burkhard A1 - Köpnick, Thomas A1 - Dietel, Reinhard A1 - Stiller, Burkhard A1 - Mercer, Frank W. T1 - Investigation of thin films made from silicon-containing poly(phenylquinoxaline-amide)s N2 - Thin films in the range of 50 nm to 10 mm thickness have been prepared from NMP solutions of silicon-containing polyphenylquinoxaline-amides which had been synthesized by the polycondensation reaction of aromatic diaminophenylquinoxalines with bis(p-chlorocarbonylphenyl)diphenylsilane. A spin-coating technique onto glass plates or onto silicon wafers was used to make the film, followed by gradual heating to remove the solvent. The resulting films were very smooth and free of pinholes when studied by atomic force microscopy (AFM). They showed a strong adhesion to silicon wafers, were thermally stable in air to above 400 °C and their dielectric constant was in the range of 3.5-3.7. Thermal treatment of the films was performed in order to induce crosslinking. Such treated films became completely insoluble in organic solvents, maintained their smoothness and strong adhesion to the silicon substrate, and did not show any Tg, in DSC experiments. Their FTIR spectra in reflection mode did not show any changes compared with the untreated films, meaning on the one hand that the polymers maintain their structural integrity at high temperature and on the other hand that the number of crosslinks was very low and could not be detected by IR spectroscopy. Y1 - 1998 ER - TY - JOUR A1 - Bruma, Maria A1 - Schulz, Burkhard A1 - Köpnick, Thomas A1 - Stiller, Burkhard A1 - Belomoina, Nataliya A1 - Mercer, Frank W. T1 - Synthesis and study of aromatic polyamides containing silicon and phenylquinoxaline rings in the main chain N2 - New poly(phenylquinoxaline-amide)s with silicon in the main chain have been prepared by polycondensation reaction of a diacid chloride, namely bis(p-chlorocarbonyl-phenyl)-diphenylsilane, with aromatic diamines containing one or two phenylquinoxaline rings separated by a flexible bridge such as ether or methylene. These polymers were easily soluble in polar aprotic solvents such as N-methylpyrrolidinone (NMP) and dimethylformamide (DMF) and showed high thermal stability with decomposition temperature being above 450°C and glass transition temperature in the range of 260- 304°C. Polymer solutions in NMP were processed into thin flexible films which exhibited very smooth surfaces, free of pinholes when studied by atomic force microscopy. The free-standing films showed a dielectric constant in the range of 3.6-3.7. Y1 - 1999 ER - TY - JOUR A1 - Bruma, Maria A1 - Schulz, Burkhard A1 - Köpnick, Thomas A1 - Stiller, Burkhard A1 - Hamciuc, Elena A1 - Mercer, Frank W. A1 - Cassidy, Peter T1 - Aromatic polyamides with hexafluoroisopropylidene groups and study of the thin Y1 - 1998 ER - TY - JOUR A1 - Bruma, Maria A1 - Schulz, Burkhard A1 - Köpnick, Thomas A1 - Stiller, Burkhard A1 - Mercer, Frank W. T1 - Study of thin films made from aromatic polyamides with silicon and phenylquinoxaline rings in the main chain N2 - Aromatic polyamides containing silicon and phenylquinoxaline rings in the main chain have been prepared by polycondensation reaction of a silicon-containing diacid chloride, namely bis(p-chlorocarbonylphenyl) -diphenylsilane, with various aromatic diamines having preformed phenylquinoxaline units. These polymers were easily soluble in polar aprotic solvents, such as N-methylpyrrolidinone (NMP) and dimethylformamide (DMF), and in tetrahydrofurane. They showed high thermal stability with decomposition temperature being above 450°C and glass transition temperature in the range of 253-304°C. Polymer solutions in NMP were processed into thin films having the thickness of tens of nanometer to 10 mm, by spin-coating onto glass plates or silicon wafers. The films had strong adhesion to substrates and exhibited very smooth surfaces, free of pinholes, in atomic force microscopy (AFM) studies. The free-standing films had dielectric constant in the range of 3.48-3.69. Thermal treatment of the films up to 350°C rendered them completely insoluble in organic solvents, while maintaining their smoothness and strong adhesion to the silicon substrate, and with no Tg in DSC experiments. Their FTIR spectra did not show any changes compared to the untreated films, meaning that polymers maintain their structural integrity at high temperature. Ó 1999 Elsevier Science S.A. All rights reserved. Y1 - 1999 ER - TY - JOUR A1 - Dimitriev, O. P. A1 - Smertenko, P. S. A1 - Stiller, Burkhard A1 - Brehmer, Ludwig T1 - Polyaniline-transition metal salt complexes: insight into formation mechanisms N2 - Two basic morphologies of emeraldine base of polyaniline-transition metal salt complex films cast from N- methylpyrrolidinone solutions are described. The first morphology consists of grains and the other consists of loose aggregates, respectively. The correlation of the film morphology with formation of precipitate in the complex solution, kinetics of solvent evaporation from the cast film, amount of solvent entrapped in the film, film conductivity, and IR absorption spectra is shown. Two different mechanisms of the complex formation as a result of competition in the polymer- inorganic salt-solvent trio interactions are discussed; the first mechanism results in folding of macromolecules into compact coils being then a core of grains in the complex films, and the second mechanism leads to blending of the polymer chains with solvent giving rise to formation of loose aggregates. (c) 2005 Elsevier B.V. All rights reserved Y1 - 2005 SN - 0379-6779 ER - TY - JOUR A1 - Gustina, D. A1 - Markava, E. A1 - Muzikante, I. A1 - Stiller, Burkhard A1 - Brehmer, Ludwig T1 - Photoisomerisation process of self-assembled monolayers of some novel azobenzenes Y1 - 1999 ER -