@article{SchulzBrumaBrehmer1997,
  author    = {Schulz, Burkhard and Bruma, Maria and Brehmer, Ludwig},
  title     = {Aromatic poly(1,3,4-oxadiazole)s as advanced materials},
  year      = {1997},
  abstract  = {Poly(1,3,4-oxadiazole)s have been the focus of considerable interest with regard to the- production of high- performance materials, particularly owing to their high thermal stability in oxidative atmosphere and specific properties determined by the structure of 1,3,4-oxadiazole ring, which, from the spectral and electronic points of view, is similar to a p-phenylene structure.[1] Besides their excellent resistance to high temperature, polyoxadiazoles have many desirable characteristics, such as good hydrolytic stability, high glass transition temperatures, low dielectric constants, and tough mechanical properties. Some polyoxadiazoles have semiconductive properties, other structures can be electrochemically doped and thus made conductive, and other have liquid-crystalline properties, which make them very attractive for a wide range of high-performance applications. They exhibit excellent fiber- and film-forming capabilities, thus being considered for use as heat-resistant reinforcing fibers for advanced composite materials, highly resistant fabrics for the filtration of hot gases, special membranes for gas separation or reverse osmosis, precursors for highly oriented graphite fibers, films, and blocks to be used in the construction of electronic instruments based on X-rays, neutron beams, or a-particles, or in the construction of nuclear reactor walls. Since they were first reported in 1961,[2] a wide variety of polymers containing 1,3,4-oxadiazole rings have been synthesized, and their preparation, characterization, and physico-mechanical properties have been periodically reviewed .[3-8] This article will present a general overview of this class of polymers and will refer to the work carried out by different researchers in the last ten years with the emphasis on the potential uses of such polymers as advanced materials.},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1998,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Stiller, Burkhard and Hamciuc, Elena and Mercer, Frank W. and Cassidy, Peter},
  title     = {Aromatic polyamides with hexafluoroisopropylidene groups and study of the thin},
  year      = {1998},
  language  = {en}
}
@article{ZhuSchulzBrumaetal.1996,
  author    = {Zhu, Shigen and Schulz, Burkhard and Bruma, Maria and Brehmer, Ludwig},
  title     = {Comparative study of the thermal properties of related aromatic polyhydrazides and poly(1,3,4-oxadiazole)s},
  issn      = {1042-7147},
  doi       = {10.1002/(SICI)1099-1581(199612)7:12<879::AID-PAT600>3.0.CO;2-X},
  year      = {1996},
  language  = {en}
}
@article{SavaSzesztayBrumaetal.1997,
  author    = {Sava, Ion and Szesztay, Marta and Bruma, Maria and Mercer, Frank W. and Schulz, Burkhard},
  title     = {Compared properties of aromatic polyamides containing silicon in the chain},
  year      = {1997},
  abstract  = {Two series of aromatic polyamides incorporating silicon together with phenylquinoxaline or with hexafluoroisopropylidene groups have been synthesized and their properties have been characterized and compared with those of related polymers. These polymers are easily soluble in polar amidic solvents such as N-rnethyl-2-pyrrolidinone and dimethylformamide, and in tetrahydrofuran, and can be cast into thin, transparent films from solution. The polyamides have weight- and number-average molecular weights in the range of 10000-40000 and 3000-6000, respectively, and polydispersities in the range of 3-10. They show glass transition temperatures in the range of 236 °C-275 °C and decomposition temperatures above 400 °C. The polymer films have low dielectric constants in the range of 3.26-3.68, and good mechanical properties (tensile strength 74-100 MPa, tensile modulus 180-386 MPa), thus being comparable with other high performance dielectrics.},
  language  = {en}
}
@article{SavaBrumaSchulzetal.2005,
  author    = {Sava, Ion and Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas},
  title     = {Comparison of properties of silicon-containing poly(amide-imide)s},
  issn      = {0954-0083},
  year      = {2005},
  abstract  = {New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations},
  language  = {en}
}
@article{BrumaMercerSchulzetal.1994,
  author    = {Bruma, Maria and Mercer, Frank W. and Schulz, Burkhard and Dietel, Reinhard and Neumann, Werner},
  title     = {Fluorinated poly(benzoxazole-imide)s},
  year      = {1994},
  language  = {en}
}
@article{BrumaHamciucHamciucetal.1996,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Hamciuc, Elena and Mercer, Frank W. and Belomoina, Nataliya and Schulz, Burkhard},
  title     = {Heterocyclic polyamides containing hexafluoroisopropylidene groups},
  year      = {1996},
  language  = {en}
}
@article{BrumaHamciucHamciucetal.1997,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Hamciuc, Elena and Mercer, Frank W. and Belomoina, Nataliya and Schulz, Burkhard},
  title     = {Heterocyclic polyamides containing hexafluoroisopropylidene groups},
  year      = {1997},
  abstract  = {New heterocyclic polyamides have been synthesized by solution polycondensation of aromatic diamines containing phenyl- quinoxaline units with diacid chlorides having both imide and hexafluoroisopropylidene (6F) groups. These polymers are soluble in polar aprotic solvents, such as N-methylpyrrolidone (NMP) or N,N-dimethylformamide (DMF), and can be cast into flexible thin films from solutions. They show high thermooxidative stability with decomposition temperatures above 400°C and glass transition temperatures in the range of 225 - 300°C. The polymer films exhibit good chemical resistance towards deluted acids and good electrical insulating properties with dielectric constants in the range of 3.2 - 3.7.},
  language  = {en}
}
@article{BrumaHamciucSavaetal.1996,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Sava, Ion and Hamciuc, Elena and Mercer, Frank W. and Fritzsche, P. and Schulz, Burkhard},
  title     = {High temperature polyamides containing pendant imide groups},
  year      = {1996},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1998,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Dietel, Reinhard and Stiller, Burkhard and Mercer, Frank W.},
  title     = {Investigation of thin films made from silicon-containing poly(phenylquinoxaline-amide)s},
  year      = {1998},
  abstract  = {Thin films in the range of 50 nm to 10 mm thickness have been prepared from NMP solutions of silicon-containing polyphenylquinoxaline-amides which had been synthesized by the polycondensation reaction of aromatic diaminophenylquinoxalines with bis(p-chlorocarbonylphenyl)diphenylsilane. A spin-coating technique onto glass plates or onto silicon wafers was used to make the film, followed by gradual heating to remove the solvent. The resulting films were very smooth and free of pinholes when studied by atomic force microscopy (AFM). They showed a strong adhesion to silicon wafers, were thermally stable in air to above 400 °C and their dielectric constant was in the range of 3.5-3.7. Thermal treatment of the films was performed in order to induce crosslinking. Such treated films became completely insoluble in organic solvents, maintained their smoothness and strong adhesion to the silicon substrate, and did not show any Tg, in DSC experiments. Their FTIR spectra in reflection mode did not show any changes compared with the untreated films, meaning on the one hand that the polymers maintain their structural integrity at high temperature and on the other hand that the number of crosslinks was very low and could not be detected by IR spectroscopy.},
  language  = {en}
}