@article{SavaBrumaSchulzetal.2005,
  author    = {Sava, Ion and Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas},
  title     = {Comparison of properties of silicon-containing poly(amide-imide)s},
  issn      = {0954-0083},
  year      = {2005},
  abstract  = {New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations},
  language  = {en}
}
@article{BrumaHamciucHamciucetal.1996,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Hamciuc, Elena and Mercer, Frank W. and Belomoina, Nataliya and Schulz, Burkhard},
  title     = {Heterocyclic polyamides containing hexafluoroisopropylidene groups},
  year      = {1996},
  language  = {en}
}
@article{BrumaHamciucSavaetal.1996,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Sava, Ion and Hamciuc, Elena and Mercer, Frank W. and Fritzsche, P. and Schulz, Burkhard},
  title     = {High temperature polyamides containing pendant imide groups},
  year      = {1996},
  language  = {en}
}
@article{ZhuSchulzBrumaetal.1996,
  author    = {Zhu, Shigen and Schulz, Burkhard and Bruma, Maria and Brehmer, Ludwig},
  title     = {Comparative study of the thermal properties of related aromatic polyhydrazides and poly(1,3,4-oxadiazole)s},
  issn      = {1042-7147},
  doi       = {10.1002/(SICI)1099-1581(199612)7:12<879::AID-PAT600>3.0.CO;2-X},
  year      = {1996},
  language  = {en}
}
@article{HamciucHamciucBrumaetal.1997,
  author    = {Hamciuc, Elena and Hamciuc, Corneliu and Bruma, Maria and Stoleriu, Andre and Schulz, Burkhard},
  title     = {Poly(hydrazide-ester)s and poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups},
  year      = {1997},
  abstract  = {A series of new arornatic poly(hydrazide-ester)s has been synthesized by solution polycondensation of two diacid dichlorides containing preformed ester groups with phenoxyterephthaloyl dihydrazide or with a mixture of phenoxyterephthaloyl dihydrazide with terephthaloyl- or isophthaloyl dihydrazide in N-methyl-2-pyrrolidinone. The thermal cyclization of the poly(hydrazide-ester)s gave the corresponding poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups. The polymers were characterized by viscometry, solubility measurements, IR spectroscopy, differential scanning calorimetry and thermogravimetric analysis.},
  language  = {en}
}
@article{SchulzBrumaBrehmer1997,
  author    = {Schulz, Burkhard and Bruma, Maria and Brehmer, Ludwig},
  title     = {Aromatic poly(1,3,4-oxadiazole)s as advanced materials},
  year      = {1997},
  abstract  = {Poly(1,3,4-oxadiazole)s have been the focus of considerable interest with regard to the- production of high- performance materials, particularly owing to their high thermal stability in oxidative atmosphere and specific properties determined by the structure of 1,3,4-oxadiazole ring, which, from the spectral and electronic points of view, is similar to a p-phenylene structure.[1] Besides their excellent resistance to high temperature, polyoxadiazoles have many desirable characteristics, such as good hydrolytic stability, high glass transition temperatures, low dielectric constants, and tough mechanical properties. Some polyoxadiazoles have semiconductive properties, other structures can be electrochemically doped and thus made conductive, and other have liquid-crystalline properties, which make them very attractive for a wide range of high-performance applications. They exhibit excellent fiber- and film-forming capabilities, thus being considered for use as heat-resistant reinforcing fibers for advanced composite materials, highly resistant fabrics for the filtration of hot gases, special membranes for gas separation or reverse osmosis, precursors for highly oriented graphite fibers, films, and blocks to be used in the construction of electronic instruments based on X-rays, neutron beams, or a-particles, or in the construction of nuclear reactor walls. Since they were first reported in 1961,[2] a wide variety of polymers containing 1,3,4-oxadiazole rings have been synthesized, and their preparation, characterization, and physico-mechanical properties have been periodically reviewed .[3-8] This article will present a general overview of this class of polymers and will refer to the work carried out by different researchers in the last ten years with the emphasis on the potential uses of such polymers as advanced materials.},
  language  = {en}
}
@article{SavaSzesztayBrumaetal.1997,
  author    = {Sava, Ion and Szesztay, Marta and Bruma, Maria and Mercer, Frank W. and Schulz, Burkhard},
  title     = {Compared properties of aromatic polyamides containing silicon in the chain},
  year      = {1997},
  abstract  = {Two series of aromatic polyamides incorporating silicon together with phenylquinoxaline or with hexafluoroisopropylidene groups have been synthesized and their properties have been characterized and compared with those of related polymers. These polymers are easily soluble in polar amidic solvents such as N-rnethyl-2-pyrrolidinone and dimethylformamide, and in tetrahydrofuran, and can be cast into thin, transparent films from solution. The polyamides have weight- and number-average molecular weights in the range of 10000-40000 and 3000-6000, respectively, and polydispersities in the range of 3-10. They show glass transition temperatures in the range of 236 °C-275 °C and decomposition temperatures above 400 °C. The polymer films have low dielectric constants in the range of 3.26-3.68, and good mechanical properties (tensile strength 74-100 MPa, tensile modulus 180-386 MPa), thus being comparable with other high performance dielectrics.},
  language  = {en}
}
@article{BrumaHamciucHamciucetal.1997,
  author    = {Bruma, Maria and Hamciuc, Corneliu and Hamciuc, Elena and Mercer, Frank W. and Belomoina, Nataliya and Schulz, Burkhard},
  title     = {Heterocyclic polyamides containing hexafluoroisopropylidene groups},
  year      = {1997},
  abstract  = {New heterocyclic polyamides have been synthesized by solution polycondensation of aromatic diamines containing phenyl- quinoxaline units with diacid chlorides having both imide and hexafluoroisopropylidene (6F) groups. These polymers are soluble in polar aprotic solvents, such as N-methylpyrrolidone (NMP) or N,N-dimethylformamide (DMF), and can be cast into flexible thin films from solutions. They show high thermooxidative stability with decomposition temperatures above 400°C and glass transition temperatures in the range of 225 - 300°C. The polymer films exhibit good chemical resistance towards deluted acids and good electrical insulating properties with dielectric constants in the range of 3.2 - 3.7.},
  language  = {en}
}
@article{SavaBrumaSchulzetal.1997,
  author    = {Sava, Ion and Bruma, Maria and Schulz, Burkhard and Mercer, Frank W. and Belomoina, Nataliya},
  title     = {Synthesis and Properties of Silicon-containing Polyamides},
  year      = {1997},
  abstract  = {A series of aromatic polyamides incorporating silicon together with phenylquinoxaline or with hexafluoroisopropylidene groups has been synthesized by solution polycondensation of a silicon-containing diacid chloride with aromatic diamines having phenylquinoxaline rings or hexafluoroisopropylidene groups. These polymers are easily soluble in polar aprotic solvents, such as N-methylpyrrolidinone and dimethylformamide, and in tetrahydrofurane, and can be solution-cast into thin, transparent films having low dielectric constant, in the range of 3.26 to 3.68. These polymers show high thermal stability with decomposition temperature being above 400 °C and glass transition temperature in the range of 236 °C to 275 °C.},
  language  = {en}
}
@article{HamciucSchulzBruma1996,
  author    = {Hamciuc, Corneliu and Schulz, Burkhard and Bruma, Maria},
  title     = {New polyhydrazides and polyoxadiazoles containing pendent phenoxy groups},
  year      = {1996},
  language  = {en}
}