@article{SavaBrumaSchulzetal.2005,
  author    = {Sava, Ion and Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas},
  title     = {Comparison of properties of silicon-containing poly(amide-imide)s},
  issn      = {0954-0083},
  year      = {2005},
  abstract  = {New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations},
  language  = {en}
}