@article{DamaceanuMarinManickeetal.2009,
  author    = {Damaceanu, Mariana-Dana and Marin, Luminita and Manicke, Thomas and Bruma, Maria},
  title     = {Solid-state properties of mesomorphic copolymers containing oxadiazole and fluorene units},
  issn      = {1539-445X},
  doi       = {10.1080/15394450903163748},
  year      = {2009},
  abstract  = {A series of copolymers containing oxadiazole and fluorene cromophores was synthesized by polycondensation of a diacid chloride incorporating one diphenylsilane linkage and a mixture of aromatic diamines containing oxadiazole and fluorene moieties. The solubility, thermal behavior, and photoluminescence ability of the thin polymer films were studied and compared with related heterocyclic polymers. These polymers are semicrystalline and form plastic mesophases in the first heating run, which brings about new ordered melted state processing opportunities. They exhibited blue photoluminescence in nanometric films, thus being promising candidates for manufacturing electroluminescent devices.},
  language  = {en}
}
@article{SavaBrumaSchulzetal.2005,
  author    = {Sava, Ion and Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas},
  title     = {Comparison of properties of silicon-containing poly(amide-imide)s},
  issn      = {0954-0083},
  year      = {2005},
  abstract  = {New silicon-containing poly(amide-imide)s have been synthesized by direct polycondensation of various aromatic diamines with a dicarboxylic acid containing the dimethylsilylene group and preformed in-tide cycles. These polymers are easily soluble in polar amidic solvents such as N-methylpyrrolidinone (NMP) or dimethylformamide (DMF) and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with initial decomposition temperature being above 400 C and glass transition temperature in the range of 220-270 degrees C. Very thin polymer films deposited by spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations},
  language  = {en}
}
@article{HamaciucBrumaKoepnicketal.2001,
  author    = {Hamaciuc, E. and Bruma, Maria and K{\"o}pnick, Thomas and Kaminorz, Yvette and Schulz, Burkhard},
  title     = {Synthesis and Study of New Silicon-containing Polyoxadiazoles},
  year      = {2001},
  abstract  = {A series of new poly-1,3,4-oxadiazoles has been synthesized by polycondensation reaction of hydrazine sulfate with a mixture of a dicarboxylic acid containing unsaturated bonds and a dicarboxylic acid containing silicon, by using methanesulfonic acid/phosphorus pentoxide as a reaction medium. These polymers were highly thermostable but they were only soluble in strong inorganic acids such as sulfuric or methanesulfonic ones. An alternative way was followed by using the corresponding dihydrazides containing unsaturated bonds and the corresponding diacid chloride containing silicon that reacted in N-methylpyrrolidinone (NMP) to give soluble silicon-containing unsaturated polyhydrazides, which were cyclodehydrated either by thermal or chemical treatment to give the corresponding polyoxadiazoles. Very thin coatings of polyhydrazides and polyoxadiazoles were deposited onto silicon wafers and they showed a very smooth surface, free of pinholes, when studied by atomic force microscopy (AFM). Some polyoxadiazole films showed strong blue photoluminescence.},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1999,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Stiller, Burkhard and Belomoina, Nataliya and Mercer, Frank W.},
  title     = {Synthesis and study of aromatic polyamides containing silicon and phenylquinoxaline rings in the main chain},
  year      = {1999},
  abstract  = {New poly(phenylquinoxaline-amide)s with silicon in the main chain have been prepared by polycondensation reaction of a diacid chloride, namely bis(p-chlorocarbonyl-phenyl)-diphenylsilane, with aromatic diamines containing one or two phenylquinoxaline rings separated by a flexible bridge such as ether or methylene. These polymers were easily soluble in polar aprotic solvents such as N-methylpyrrolidinone (NMP) and dimethylformamide (DMF) and showed high thermal stability with decomposition temperature being above 450°C and glass transition temperature in the range of 260- 304°C. Polymer solutions in NMP were processed into thin flexible films which exhibited very smooth surfaces, free of pinholes when studied by atomic force microscopy. The free-standing films showed a dielectric constant in the range of 3.6-3.7.},
  language  = {en}
}
@article{BrumaHamciucSchulzetal.1999,
  author    = {Bruma, Maria and Hamciuc, Elena and Schulz, Burkhard and K{\"o}pnick, Thomas and Stiller, Burkhard and Mercer, Frank W.},
  title     = {Synthesis of fluorinated poly(phenylquinoxaline-amide)s and study of thin films made therefrom},
  year      = {1999},
  abstract  = {A series of five fluorinated poly(phenylquinoxaline-amide)s were synthesized by a polycondensation reaction of a diacid chloride containing the hexafluoroisopropylidene (6F) group, namely 2,2-bis(p-chlorocarbonylphenyl)- hexafluoropropane, with various aromatic diamines incorporating two phenyl-substituted quinoxaline rings. These polymers were easily soluble in polar aprotic solvents such as N-methylpyrrolione (NMP), dimethylformamide (DMF), and tetrahydrofurane (THF), and showed a high thermal stability with decomposition temperatures above 400 °C and glass transition temperatures in the range of 260-290 Tg. Polymer solutions in NMP were processed into free-standing films that showed low dielectric constant values, in the range of 3.4-3.9, and good mechanical properties, with tensile strength in the range of 40-80 MPa and elongation to break in the range of 22-55\%. Very thin films, in the range of tens of nanometer, which were deposited onto silicon wafers exhibited very smooth surfaces, free of pinholes when studied by atomic force microscopy (AFM).},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1999,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Stiller, Burkhard and Mercer, Frank W.},
  title     = {Study of thin films made from aromatic polyamides with silicon and phenylquinoxaline rings in the main chain},
  year      = {1999},
  abstract  = {Aromatic polyamides containing silicon and phenylquinoxaline rings in the main chain have been prepared by polycondensation reaction of a silicon-containing diacid chloride, namely bis(p-chlorocarbonylphenyl) -diphenylsilane, with various aromatic diamines having preformed phenylquinoxaline units. These polymers were easily soluble in polar aprotic solvents, such as N-methylpyrrolidinone (NMP) and dimethylformamide (DMF), and in tetrahydrofurane. They showed high thermal stability with decomposition temperature being above 450°C and glass transition temperature in the range of 253-304°C. Polymer solutions in NMP were processed into thin films having the thickness of tens of nanometer to 10 mm, by spin-coating onto glass plates or silicon wafers. The films had strong adhesion to substrates and exhibited very smooth surfaces, free of pinholes, in atomic force microscopy (AFM) studies. The free-standing films had dielectric constant in the range of 3.48-3.69. Thermal treatment of the films up to 350°C rendered them completely insoluble in organic solvents, while maintaining their smoothness and strong adhesion to the silicon substrate, and with no Tg in DSC experiments. Their FTIR spectra did not show any changes compared to the untreated films, meaning that polymers maintain their structural integrity at high temperature. {\´O} 1999 Elsevier Science S.A. All rights reserved.},
  language  = {en}
}
@article{BrumaSavaMerceretal.1998,
  author    = {Bruma, Maria and Sava, Ion and Mercer, Frank W. and Reddy, Victor N. and K{\"o}pnick, Thomas and Stiller, Burkhard and Schulz, Burkhard},
  title     = {Silicon-containing poly(amide-ether)s},
  year      = {1998},
  abstract  = {New aromatic poly(amide-ether)s (II) have been synthesized by solution polycondensation of various aromatic diamines having two ether bridges (I) with a diacid chloride containing silicon, namely bis(chlorocarbonylphenyl)- diphenyIsilane. These polymers are easy soluble in polar amidic solvents such as N-methylpyrrolidinone or dimethylformamide and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability with initial decomposition temperature being above 400 °C. Their glass transition temperatures lie in the range of 220-250 °C, except for polymer He which did not show a clear Tg when heated in a differential scanning calorimetry experiment up to 300 °C. The large interval between the glass transition and decomposition temperatures of pnlymers Ia-Id could be advantageous for their processing via compression molding. The polymer coatings deposited by the spincoating, technique onto silicon wafers showed a very smooth, pinhole-free surface in atomic force microscopy investigations. The free-standing films of 20-30 mm thickness show low dielectric constant, in the range of 3.65-3.78, which is promising for future application as high performance dielectrics.},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1998,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Dietel, Reinhard and Stiller, Burkhard and Mercer, Frank W.},
  title     = {Investigation of thin films made from silicon-containing poly(phenylquinoxaline-amide)s},
  year      = {1998},
  abstract  = {Thin films in the range of 50 nm to 10 mm thickness have been prepared from NMP solutions of silicon-containing polyphenylquinoxaline-amides which had been synthesized by the polycondensation reaction of aromatic diaminophenylquinoxalines with bis(p-chlorocarbonylphenyl)diphenylsilane. A spin-coating technique onto glass plates or onto silicon wafers was used to make the film, followed by gradual heating to remove the solvent. The resulting films were very smooth and free of pinholes when studied by atomic force microscopy (AFM). They showed a strong adhesion to silicon wafers, were thermally stable in air to above 400 °C and their dielectric constant was in the range of 3.5-3.7. Thermal treatment of the films was performed in order to induce crosslinking. Such treated films became completely insoluble in organic solvents, maintained their smoothness and strong adhesion to the silicon substrate, and did not show any Tg, in DSC experiments. Their FTIR spectra in reflection mode did not show any changes compared with the untreated films, meaning on the one hand that the polymers maintain their structural integrity at high temperature and on the other hand that the number of crosslinks was very low and could not be detected by IR spectroscopy.},
  language  = {en}
}
@article{BrumaSchulzKoepnicketal.1998,
  author    = {Bruma, Maria and Schulz, Burkhard and K{\"o}pnick, Thomas and Stiller, Burkhard and Hamciuc, Elena and Mercer, Frank W. and Cassidy, Peter},
  title     = {Aromatic polyamides with hexafluoroisopropylidene groups and study of the thin},
  year      = {1998},
  language  = {en}
}
@article{HamciucHamciucBrumaetal.1997,
  author    = {Hamciuc, Elena and Hamciuc, Corneliu and Bruma, Maria and Stoleriu, Andre and Schulz, Burkhard},
  title     = {Poly(hydrazide-ester)s and poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups},
  year      = {1997},
  abstract  = {A series of new arornatic poly(hydrazide-ester)s has been synthesized by solution polycondensation of two diacid dichlorides containing preformed ester groups with phenoxyterephthaloyl dihydrazide or with a mixture of phenoxyterephthaloyl dihydrazide with terephthaloyl- or isophthaloyl dihydrazide in N-methyl-2-pyrrolidinone. The thermal cyclization of the poly(hydrazide-ester)s gave the corresponding poly(1,3,4-oxadiazole-ester)s containing pendent phenoxy groups. The polymers were characterized by viscometry, solubility measurements, IR spectroscopy, differential scanning calorimetry and thermogravimetric analysis.},
  language  = {en}
}