TY  - JOUR
A1  - Jiang, Yi
A1  - Mansfeld, Ulrich
A1  - Kratz, Karl
A1  - Lendlein, Andreas
T1  - Programmable microscale stiffness pattern of flat polymeric substrates by temperature-memo technology
T2  - MRS Communications
N2  - Temperature-memory technology was utilized to generate flat substrates with a programmable stiffness pattern from cross-linked poly(ethylene-co-vinyl acetate) substrates with cylindrical microstructures. Programmed substrates were obtained by vertical compression at temperatures in the range from 60 to 100 degrees C and subsequent cooling, whereby a flat substrate was achieved by compression at 72 degrees C, as documented by scanning electron microscopy and atomic force microscopy (AFM). AFM nanoindentation experiments revealed that all programmed substrates exhibited the targeted stiffness pattern. The presented technology for generating polymeric substrates with programmable stiffness pattern should be attractive for applications such as touchpads. optical storage, or cell instructive substrates.
Y1  - 2019
UR  - https://publishup.uni-potsdam.de/frontdoor/index/index/docId/50053
SN  - 2159-6859
SN  - 2159-6867
VL  - 9
IS  - 1
SP  - 181
EP  - 188
PB  - Cambridge Univ. Press
CY  - New York
ER  -